New PDF release: Advanced Millimeter-wave Technologies: Antennas, Packaging

By Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher

ISBN-10: 047074295X

ISBN-13: 9780470742952

ISBN-10: 0470742968

ISBN-13: 9780470742969

ISBN-10: 047099617X

ISBN-13: 9780470996171

This booklet explains one of many preferred themes in instant and digital units group, particularly the instant verbal exchange at mmWave frequencies, in particular on the 60 GHz ISM band.  It presents the reader with wisdom and strategies for mmWave antenna layout, evaluate, antenna and chip packaging. Addresses functional engineering matters akin to RF fabric assessment and choice, antenna and packaging necessities, production tolerances, antenna and procedure interconnections, and antenna one of many first books to debate the rising examine and alertness parts, rather chip applications with built-in antennas, wafer scale mmWave phased arrays and imaging includes a reliable variety of case experiences to assist figuring out offers the antenna and packaging applied sciences for the newest and rising purposes with the emphases on antenna integrations for sensible purposes similar to instant USB, instant video, section array, car collision avoidance radar, and imaging 

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Extra info for Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits

Sample text

5 RF Electronics The RF electronics make up the body of any wireless device and consist of a receiver and transmitter where each place critical and sometimes conflicting requirements on both the antenna and the package. For example, loss between the antenna and the RF electronics decreases transmit output power and increases system noise figure directly; thus, each RF subsystem needs to be located close to the antenna. Since there are physical limitations and both cannot be minimized, tradeoffs must be made as to which should be the closest.

The surface of the aluminum is gold plated to form a corrosion-resistant electrically conductive layer. The package is protected by a gold-plated aluminum lid for excellent shielding efficiency. A hybrid circuit technology is used to mount semiconductor components as bare die on a thin-film substrate. The process features bare die wire or ribbon bonding, beam lead, flipchip, or surface mount device (SMD) mounting. The process supports 4 µm gold conductors, laser trimmable NiCr thin-film resistors, SiN thin-film capacitors, air bridges, and via holes.

In summary, the above discussion is the framework that will be used throughout the book, but it represents just a simple skeleton of topics that will be covered in much more detail. As the reader can imagine, this work extends far beyond simple packaging, circuits and antennas. As an example, if these packages with integral antennas can be made with outer dimensions less than half a wavelength, then integrated arrays of these could be built that form the basis of phased array systems. This could be taken to an extreme, where an entire wafer of silicon circuits could be wafer bonded to a passive silicon wafer with the antenna directly above the RF electronics and form the entire basis of a phased array system.

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Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits by Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher

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